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601-2

D-SUB High Density IP-67 601 2

DSUB, D-SUB High Density IP-67

Through-hole right angled

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Illustration D-SUB High Density IP-67  601  2
Technical data
Moreless
Pincount 15, 26, 44
Gender Female, Male
Material contact Copper alloy
Plating contact Au
Material insulator Thermoplast UL94V-0
Rated current IEC 3,0 A
Rated voltage 60 V RMS / V DC
Withstand voltage 500 V RMS for 1 Minute
Operating temperature -55°C to +85°C
Max. processing temper. 230°C for 10 seconds
Board termination Through hole Through hole
Orientation to PCB Parallel Parallel
No of rows 3
Industry standard DSUB
Mounting option DSUB Rivet #4-40, Rivet + jack screw attached, Rivet + jack screw inserted
Color black
Plating shell Ni, Sn
Packaging Standard
 D-SUB High Density IP-67  601  2 1 D-SUB High Density IP-67  601  2 2 D-SUB High Density IP-67  601  2

Pincount
015
026
044
+49 (0) 83 62 / 91 56-0