601-2

D-SUB High Density IP-67 601 2

DSUB, D-SUB High Density IP-67

Through-hole right angled

Pincount	15, 26, 44
Gender	Female, Male
Material contact	Copper alloy
Plating contact	Au
Material insulator	Thermoplast UL94V-0
Rated current IEC	3,0 A
Rated voltage	60 V RMS / V DC
Withstand voltage	500 V RMS for 1 Minute
Operating temperature	-55°C to +85°C
Max. processing temper.	230°C for 10 seconds
Board termination	Through hole
Orientation to PCB	Parallel
No of rows	3
Industry standard	DSUB
Mounting option DSUB	Rivet #4-40, Rivet + jack screw attached, Rivet + jack screw inserted
Color	black
Plating shell	Ni, Sn
Packaging	Standard