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  4. D-SUB High Density IP-67 Solder cup Series 601 Variant 3
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601-3

D-SUB High Density IP-67 Solder cup Series 601 Variant 3

DSUB, D-SUB High Density IP-67

D-SUB high density for PCB and wire termination according to IP-67.

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Technical data
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Material insulator Thermoplast UL94V-0
Plating contact Au
Plating shell Ni, Sn
Packaging Standard
Material contact Copper alloy
Rated current 3,0 A
Rated voltage 60 V RMS / V DC
Withstand voltage 500 V RMS for 1 Minute
Operating temperature -55°C to +85°C
Max. processing temper. 230°C for 10 seconds
Pincount 15, 26, 44
No of rows 3
Cable termination Solder cup
Industry standard DSUB
Mounting option DSUB Rivet #4-40, Rivet + jack screw attached, Rivet + jack screw inserted
Color black
Pincount
015
026
044
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