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  4. D-SUB High Density IP-67 Series 601 Variant 1
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601-1

D-SUB High Density IP-67 Series 601 Variant 1

DSUB, D-SUB High Density IP-67

Through-hole straight

Available variations
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Technical data
Moreless
Pincount 15
Material contact Copper alloy
Plating contact Au
Material insulator Thermoplast UL94V-0
Rated current IEC 3,0 A
Rated voltage 60 V RMS / V DC
Withstand voltage 500 V RMS for 1 Minute
Operating temperature -55°C to +85°C
Max. processing temper. 230°C for 10 seconds
Board termination Through hole Through hole
Orientation to PCB Vertical Vertical
No of rows 3
Industry standard DSUB
Mounting option DSUB Rivet #4-40, Rivet + jack screw attached, Rivet + jack screw inserted
Color black
Plating shell Ni, Sn
Packaging Standard
PolzahlABCD
1539,2024,8016,9016,30
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