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Technical data
Pitch (mm) 1,778 Shrink dip
Mating pin size (range) ø 0,40-0,56
☐ 0,25x0,45
Pincount 64
Gender Female
Polarising no
Material contact Copper alloy
Plating contact Au, Sn
Material insulator High temp. thermoplast UL94V-0
Rated current IEC 3,0 A
Rated voltage 150 V RMS / V DC
Withstand voltage 1000 V RMS for 1 Minute
Operating temperature -55°C to +125°C
Max. processing temper. 260°C for 10 seconds
Board termination Through hole Through hole
Orientation to PCB Vertical Vertical
No of rows 2
Row distance (code) 300 mil, 400 mil, 600 mil, 700 mil
Contact type Standard Shrink Standard Shrink
Plating clip Au, Au 0,75 µ
Row distance (mm) 10,16, 15,24, 19,05, 7,62
Material clip Berylium Copper
Socket layout DIL (Dual-in-line) DIL (Dual-in-line)
Type IC Socket
Packaging Tube
+49 (0) 83 62 / 91 56-0