Technical data
Moreless| Pitch (mm) | 1,778 Shrink dip |
| Mating pin size (range) |
ø 0,40-0,56 ☐ 0,25x0,45 |
| Pincount | 64 |
| Polarising | No |
| Material contact | Copper alloy |
| Plating contact | Au, Sn |
| Material insulator | High temp. thermoplast UL94V-0 |
| Rated current IEC | 3,0 A |
| Rated voltage | 150 V RMS / V DC |
| Withstand voltage | 1000 V RMS for 1 Minute |
| Operating temperature | -55°C to +125°C |
| Max. processing temper. | 260°C for 10 seconds |
| Board termination | 
Through hole
|
| Orientation to PCB | 
Vertical
|
| No of rows | 2 |
| Row distance (code) | 300 mil, 400 mil, 600 mil, 700 mil |
| Contact type | |
| Plating clip | Au, Au 0,75 µ |
| Row distance (mm) | 10,16, 15,24, 19,05, 7,62 |
| Material clip | Berylium Copper |
| Socket layout | 
DIL (Dual-in-line)
|
| Type | IC Socket |
| Packaging | Tube |
